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Electronics	Module	Hybrid	Pixel Mechanics
Pixel Module Production
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Pixel Detectors, Modules, and Bump Bonding Module Concept Module Assembly Disk region consists of sectors, each with 6 modules. Eight sectors form a complete disk. Sectors consist of carbon-carbon face plate and Al cooling pipes. Barrel region consists of staves, each with 13 modules. A total of 112 staves are required for three layer pixel system. Staves are also made of carbon-carbon with Al pipes. Sector Stave Bump Bonding ASICs are bump bonded to the detectors. Two vendors are chosen: - AMS (Rome) does Indium bumping - IZM (Berlin) does solder bumping The Bare Module consists of sensor + 16 FE chips for an active area of ~ 10 cm2 and 46,080 channels Bump Bonding Prototypes and Studies