Bump Bonding

Prototypes and Results

Boeing

Prototype pixel mechanical module.
Sixteen chips attached to silicon
substrate by indium bump bonding
done by Boeing.
Each chip has 3840 bump bonds Prototype pixel mechanical
die with 3840 indium bumps
done by Boeing (detailed)

Sixteen chip module with FE-B ICs
assembled with indium bumps

**Seiko**

Seiko bump bonding (detail)	Seiko mockup module	First Seiko bumps

**Diamond Tech One (DTO)**

DTP Indium bomp bonding	DTO solder bump bonding

Hamamatsu n-on-n detectors with Indium bump-bonding

LBL p-bulk detectors

LBL p-bulk detectors bump bonding

Pixel Detector Layout
(S.Holland drawings)

LBL Detector chip assembly


Prototype pixel mechanical module. Sixteen chips attached to silicon substrate by indium bump bonding done by Boeing. Each chip has 3840 bump bonds	Prototype pixel mechanical die with 3840 indium bumps done by Boeing	(detailed)