On-detector electronics consists of a chip-set of four ASICs, developed in
IBM 0.25 micron CMOS process.
It must withstand dose of 50MRad
density of 5000 channels/cm2
power budget <0.6 W/cm2.
Final production versions was in 2003.
Have completed full production of opto-chips and MCC.
FE chip production order is 246 8" wafers.
Average yied for recent wafers has been 85-90%.
Front End Chip
2880 channels
Module Control Chip (MCC)
Manages data and control
between module's 16 chips
